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真空 ›› 2026, Vol. 63 ›› Issue (1): 22-27.doi: 10.13385/j.cnki.vacuum.2026.01.04

• 薄膜 • 上一篇    下一篇

基于氮气流动辅助的板级封装基板翘曲改善实验研究*

李婷, 陈志强, 方安安, 胡小波, 杨洪生, 张晓军   

  1. 深圳市矩阵多元科技有限公司,广东 深圳 518110
  • 收稿日期:2024-11-01 出版日期:2026-01-25 发布日期:2026-02-02
  • 通讯作者: 张晓军,博士。
  • 作者简介:李婷（1998-）,女,四川省泸州市人,硕士。
  • 基金资助:
    *深圳市科技计划资助（KQTD20190929172532382）

Improvement of Panel-Level Packaging Substrates Using N2 Flow Assistance

LI Ting, CHEN Zhiqiang, FANG Anan, HU Xiaobo, YANG Hongsheng, ZHANG Xiaojun   

  1. Arrayed Materials Co., Ltd., Shenzhen 518110, China
  • Received:2024-11-01 Online:2026-01-25 Published:2026-02-02

摘要： 扇出型面板级封装（FOPLP）技术在异质晶片整合和降本增效方面优势显著,但在热应力影响下,基板尺寸增大时翘曲也随之增大。本文针对大尺寸玻璃基板在真空腔体中的升降温过程,设计系列验证试验,研究了高温腔体压力（10-3 Pa、20 Pa、100 Pa、105 Pa）及N2气流辅助对基板升降温行为和温度分布的影响。结果表明：相同升温参数和时间下,随腔体压力降低,基板升温速率减小,中心与边角温差增大,降温过程中则呈相反趋势;腔体压力大约100 Pa时,升降温过程中基板表面温度均匀性较好,引入N2气流可提高升降温效率,使边缘与中心区域温差维持在5~10 ℃。

关键词: 扇出型板级先进封装, 玻璃基板, 除气, N2辅助, 热应力翘曲

Abstract: Fan-out panel-level packaging （FOPLP） technology demonstrates significant advantages in heterogeneous chip integration and cost reduction, yet the increase in substrate size exacerbates the thermal stress warpage. Aimed at the heating and cooling processes of large-size glass substrates in vacuum chambers, a series of validation experiments were designed to investigate the effects of different pressure conditions （10-3, 20, 100 and 105 Pa） and N2 gas flow assistance on the thermal behavior and temperature distribution of the substrates. The results show that under the same heating parameters and duration, the lower degas chamber pressure causes slower substrate heating rate and larger temperature difference between the center and the corner, while the opposite trend is observed during the cooling process. When the chamber pressure is approximately 100 Pa, the substrate surface provides the most stable heating condition. Introducing a low flow rate of N2 at 100 Pa can improve the heating and cooling efficiency, and maintain the the edge and the center temperature difference at 5-10 ℃.

Key words: FOPLP, glass substrate, degas, N2 flow assistance, thermal stress warpage

中图分类号:  TB79

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