Ni-Zn铁氧体基板金属化技术研究

doi:10.13385/j.cnki.vacuum.2019.04.07

VACUUM ›› 2019, Vol. 56 ›› Issue (4): 31-33.doi: 10.13385/j.cnki.vacuum.2019.04.07

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Study on Metallization Technology of Ni-Zn Ferrite Substrate

LI Bao-chang^{1, 2}, LIU Guang-zhuang³, YANG Zhao^{1, 2}, LUO Jun-yao^{1, 2}, TA Shi-wo^{1, 2}

1.Guangdong Fenghua Advanced Technology Holding CO., LTD Zhaogqing 526000, China;
2.State Key Laboratory of Advanced Materials and Electronic Components.,Zhaoqing 526000,China;
3.Guangdong AIB Polytchnic,Guangzhou 526000, China)

Received:2018-12-18 Published:2019-08-22

Abstract

Abstract: The surface metallization of the Ni-Zn ferrite substrate was carried out by using the evaporation coating technology. After the patterning process, the adhesion and weldability were tested and compared with that of the sample surface metallized by electroless plating. The results show that the surface prepared by evaporation coating of the metal film layer is superior to the electroless plating in appearance and adhesion, and has good solderability, which can content the requirements of metallization of Ni-Zn ferrite substrate and related products. At the same time, it proves that this technology is a promising and stable process surface metallization method in the application of high frequency and high power electronic ceramic substrates.

Key words: ferrite, metallization, evaporation

CLC Number:

TB43

LI Bao-chang, LIU Guang-zhuang, YANG Zhao, LUO Jun-yao, TA Shi-wo. Study on Metallization Technology of Ni-Zn Ferrite Substrate[J].VACUUM, 2019, 56(4): 31-33.

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