VACUUM ›› 2019, Vol. 56 ›› Issue (1): 56-58.doi: 10.13385/j.cnki.vacuum.2019.01.12
CHEN Wen-bo 1,2, CHEN Lun-jiang 1, Liu Chuan-dong 1, CHENG Chang-ming 1, TONG Hong-hui 1, ZHU Hai-long3
CLC Number:
[1] | LI Lin, LI Cheng-ming, YANG Gong-shou, HU Xi-duo, YANG Shao-yan, SU Ning. Numeric simulation of three-layer hot-wall metal organic chemical vapor deposition (MOCVD) flow fields [J]. VACUUM, 2019, 56(1): 34-38. |
[2] | WANG Xiao-dong, WU Hong-yue, ZHANG Guang-li, LI He, SUN Hao, DONG Jing-liang, TU Ji-yuan. Computational fluid dynamics approach and its applications in vacuum technology [J]. VACUUM, 2018, 55(6): 45-48. |
|