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VACUUM ›› 2021, Vol. 58 ›› Issue (4): 58-62.doi: 10.13385/j.cnki.vacuum.2021.04.11

• Vacuum Metallurgy and Thermal Engineering • Previous Articles     Next Articles

Finite Elements Analysis and Optimal Design for the Temperature Field of Vacuum Brazing Furnace

XIE Yong-qiang1, JIN Li-yan1, YANG Xiao-dong1, WANG Cheng-jun1, XIA Dan2, SU Chun2   

  1. 1. The 2th Research Institute of CETC,Taiyuan 030024,China;
    2. School of Mechanical Engineering,Southeast University,Nanjing 211189,China
  • Received:2020-06-22 Online:2021-07-25 Published:2021-08-05

Abstract: With the development of miniaturization,high density and high reliability of semiconductor device packaging,high temperature uniformity is required for brazing heat field in semiconductor industry. Selecting a type of vacuum brazing furnace as the research object,the technique of finite elements simulation is applied to analyze the distribution of temperature field as well as its change rule inside of the furnace. The basic procedure for carrying out finite elements analysis is introduced. With the aim to analyze the temperature uniformity,the finite elements simulation model is established based on practical engineering data,and the distribution of temperature field and its change process are obtained. By comparing with the test data,the effectiveness of the model and simulation procedure is verified. The results show that the distribution of the furnace temperature field meets the design requirement. Moreover,the corresponding simulation results also provide theoretical foundation and effective means for the optimization and improvement of such kinds of equipments.

Key words: vacuum brazing of semiconductor device, temperature uniformity, finite elements analysis, continuous improvement

CLC Number: 

  • TH122
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