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VACUUM ›› 2024, Vol. 61 ›› Issue (1): 1-9.doi: 10.13385/j.cnki.vacuum.2024.01.01

• Thin Film •     Next Articles

Research on Pulsed Cathodic Arc Plasma and the Related Characteristics

WU Hong-chen, YANG Li-yuan   

  1. AECC Beijing Institute of Aeronautical Materials, Beijing 100095, China
  • Received:2023-05-25 Online:2024-01-25 Published:2024-01-24

Abstract: Cathodic arc is an important material source for a variety of film and coating preparation processes. From the cathode spot on the cathode surface, the generation (phase transition) and expansion (transport) of plasma in the vacuum chamber, to the final deposition on the biased substrate to form a coating or film, this series of links contain complex physical processes. Deeply analyzing and understanding of the processes and related mechanisms will undoubtedly play an important role in guiding the coating preparation process. This paper briefly introduces the process of the discharge phenomena and the history of the related coatings development. Then the cathode discharge mechanism and the plasma behaviors closely related to the coating process, such as plasma velocity, sheath, oblique incidence and attachment coefficient are discussed. The aim is to help readers form a clear physical image and context for the process of cathode arc and its coating formation, and serve to guide the practice of scientific research and production.

Key words: cathode arc, pulsed cathodic arc plasma, plasma sheath, oblique incidence, attachment coefficient

CLC Number:  O539;TB43

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