VACUUM ›› 2020, Vol. 57 ›› Issue (2): 1-7.doi: 10.13385/j.cnki.vacuum.2020.02.01
• Vacuum Acquisition System • Next Articles
JIANG Xie-chang
CLC Number:
[1] | LEYBOLD A G.Brochure“Vacuum Technology for Chemical Engineering” [Z]. 1983. |
[2] | 曹羽, 罗根松.气冷式直排大气罗茨真空泵及机组的热平衡计算[J]. 真空,2002, (2);20-21. |
[3] | 张宝夫,王西龙, 等. 新颖的4000吨亚磷酸-二甲酯真空抽气系统[J]. 真空,2002, (5);38-41. |
[4] | 姜燮昌. 真空获得技术面临的挑战与对策[J]. 真空,2007, (2):1-17. |
[5] | 姜燮昌. 螺杆真空泵的特点与应用[J].真空,2013, (2):1-7. |
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