Abstract: Three Cu-PET-Cu composite films with different thicknesses of Cu film were prepared by electron beam evaporation. The mechanical and electrical properties of Cu-PET-Cu composite films were studied by experiments and molecular dynamics simulation. The results show that the uneven deposition and rough surface are observed for the thin film, and the surface becomes flat with increasing Cu thickness. As the thickness of the Cu film increases, the tensile strength of the composite film increases, while the elongation decreases. The composite film has a highest tensile strength of 250 MPa and elongation of 20% when the thickness of composite film is 6.069 μm. The results of molecular dynamics simulation are consistent with those obtained by experiments. The resistivity of composite films decreases first, and then increases with increasing copper layer thickness. The minimum resistivity is 1.834×10^-6 Ω∙m, which is higher than that of pure copper.

Key words: composite film, tensile strength, resistivity, experiment, molecular dynamics simulation