真空材料放气率高精度测量装置*

doi:10.13385/j.cnki.vacuum.2023.04.11

Abstract

Abstract: This paper introduces a set of high-precision measuring device for the outgassing rate of vacuum materials based on the method of switching between two pumping paths developed by the engineering machinery vacuum auxiliary laboratory of SSRF Ⅱ beamline project. Based on this method, the outgassing rate of common oxygen free copper material samples in the synchrotron radiation vacuum system was tested. The outgassing amount of the sample with background and the background in the conditions of different temperature, outgassing time,and after the gas path conversion was measured and caculated. The results show that the oxygen free copper outgassing rate is 3.06×10^-12Pa·m³·s^-1·cm^-2 after 72h baking at 150℃, it indicates that the device has a high test accuracy of outgassing rate which can meet the measurement requirements of synchrotron radiation device for the outgassing rate of ultra-high vacuum materials.

Key words: vacuum material, outgassing rate, SPP method

CLC Number: TB74

LI Jin-ming, WANG Jin-wei, LIU Jun-nan, CHEN Ming. High-precision Measurement Device for Outgassing Rate of Vacuum Materials[J].VACUUM, 2023, 60(4): 60-64.

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High-precision Measurement Device for Outgassing Rate of Vacuum Materials

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