Josephson junction is the key electrical element in superconductive electronics and quantum information. It is a type of non-linear device composed of two superconductors separated by a thin dielectric. Most superconducting qubits use the Al/AlO_x/Al junction. The fabrication of such junctions on quantum chips involves ion beam etching, electron beam evaporation with adjustable sample orientation, and controllable oxidation. The samples should not leave the vacuum during the fabrication process. The homemade Josephson junction processing system is a ultra high vacuum system with three processing chambers. Samples can be automatically transferred between the chambers to complete the fabrication. The processing steps of the system have been experimentally verified.

The surface of the quartz fiber/cyanate ester composite material at different working distances was activated by plasma treatment technology. The influence of plasma treatment parameters on the surface contact angle of the composite was investigated, as well as the changes of surface morphology, the intrinsic performance and membrane-based bonding strength before and after plasma treatment. The results show that the surface contact angle of the composite material decreases significantly after plasma treatment with nitrogen and argon, and decreases with the decrease of action distance. Moreover, the overall activation effect of argon is better than that of nitrogen. The important degree of influence factors of process parameters is in order of air pressure, voltage and time. If the air pressure and voltage are increased in a certain range and the treatment time is extended, the surface contact angle of composite material becomes smaller and the activation effect is better. The glass transition temperature and bending strength of the composites is unchanged, showing that the intrinsic performance of the composites are not damaged before and after plasma treatment. After plasma treatment,the surface roughness and specific surface area of the composite increase, and the membrane-based bonding strength of the composite with Al coating increases significantly.

On the research of a small triggered vacuum arc ion source, the trigger process is very crucial to the following processes such as arcing and extraction. The traditional trigger structure is a sandwich structure including trigger, insulator and cathode. The triggering process is the surface discharge process on the insulator surface. It needs a very rigorous condition to realize stable triggering discharge for this structure. Optimizing the trigger structure can effectively improve the stability of the ion source and reduce the cost and ability of the power source. Therefore, we propose a new trigger structure in this paper, which also demonstrates the stability of triggering discharge.

In order to meet the requirement of gradient temperature control in the thermal vacuum test of a certain type of aerospace products, a set of high precision gradient temperature control system was designed. The system is composed of heat sink, heater and supporting temperature control system, etc., which can meet the gradient temperature control requirements of products such as load, and the temperature control precision can reach ±0.2℃. This paper introduces the design of the temperature control structure, the frame of the temperature control structure and the PID temperature control principle of the system. The system is used to test the gradient temperature control in product zones, and it runs stably and reliably in the test. The experimental results show that the system can meet the requirements of gradient temperature control in product zones, and the temperature control accuracy is high.

In this paper, according to the structural characteristics and tightness requirement of printed circuit heat exchanger, the leak detection scheme of printed circuit heat exchanger is established through the selection of leakage detection method, leakage rate index setting and leakage rate calculation. Based on the leak detection scheme, helium leak detecting of the actual printed circuit heat exchangers was completed,and the measured leakage rate met the acceptance requirements. It is confirmed by water pressure testing and air pressure testing that the leakage rate index is set reasonably and the leak detection process is reliable.

In the KALPUREX(Karlsruhe liquid metal based pumping process for fusion reactor exhaust gases) process proposed by Karlsruher Institut für Technologie(KIT), the linear mercury diffusion pump(LMDP) is used for the exhaust gas of fusion reactor to realize continuously pumping, so as to solve the problem of high tritium inventory caused by the use of the cryogenic pump. In order to support the design of LMDP, the pumping performance of LMDP is simulated based on the Direct Simulation Monte Carlo(DSMC) method. Based on the structure of LMDP in the early experiment, the pumping speed of air and the back-streaming rate of mercury are simulated, and their relationships with the pressure are analyzed. For hydrogen(as the representative of hydrogen isotope), helium, neon and argon, which would be contained in the exhaust gas of fusion reactor, the pumping performance of LMDP is simulated respectively. The relationship between the pumping speeds of different gases and their molar mass is consistent between the simulation result and the theoretical prediction.

The research of rapid decompression process with its effect assessment and protection technology is the problem that must be faced by the future exploration projects such as near space exploration and deep space exploration. In order to analyze the characteristics of gas flow field in decompression process and predict decompression and equilibrium time more realistically and accurately, a numerical simulation method based on dynamic grid technology was proposed to complete the simulation analysis of the ground simulation facility for decompression. The results show that when the relief valve is not fully opened in place, the pressure of the two chambers is basically equal, the average pressure loss of the elbow is large at the initial stage of decompression, but slows down at the later stage. The analysis method based on dynamic grid technology can overcome the problem of insufficient predictive ability of traditional methods in the opening process of relief valve, and can effectively obtain the gas flow characteristics and pressure change law in the full cycle process of decompression.

Jet circulation hot air heating and drying technology is a vacuum drying technology, which uses compressed air jet drive to replace the disturbance of traditional fan to realize convective heat transfer of hot air circulation and heating transformer. This technology overcomes the shortcomings of traditional hot air circulation and pressure drying technology, and improves the technical performance of transformer hot air circulation drying from the physical principle.It has remarkable effect on improving heating efficiency of drying equipment, preventing rust of iron core, improving temperature distribution and ensuring vacuum degree of drying system.

The cryopump with GM refrigerator as the core component is a kind of ultra-high vacuum acquisition equipment. Owing to its characteristics and advantages, it has been widely used in integrated circuit manufacturing processes and equipment. In recent years, with the rapid development of China′s integrated circuit manufacturing equipment and complete sets of technology, the demand for cryopumps as important components is also increasing. The technical development status of imported cryopump products in domestic integrated circuit manufacturing is introduced, and the technical characteristics of different products are compared. The history and current situation of domestic cryopumps entering the integrated circuit manufacturing industry are described.

In order to improve the poor impact resistance of thin films prepared on copper alloy, chromium doped diamond-like carbon（Cr-DLC） films with Cr/CrN interlayer of different thickness were prepared on KK3 copper alloy. Cross-section morphology, microstructure,mechanical properties and impact resistance of Cr-DLC films were studied by scanning electron microscope, Raman spectra, nanoindentation and repetitive impact tester, respectively. The results illustrate that the residual stress, elastic modulus, adhesion strength and impact resistance of Cr-DLC films have close connections with thickness of Cr/CrN interlayer. Residual stress of Cr-DLC coated copper alloy decreases first and then increases with the interlayer thickness increasing, which reaches the least value of -0.47GPa when the interlayer thickness was 1.01μm, and the hardness and elastic modulus of Cr-DLC films are 11.68GPa and 144.54GPa, respectively. Adhesion strength increases first and then decreases with the increase of interlayer thickness, which reaches the maximum of 50N when the interlayer is 1.01μm. Impact craters are generated on the surface of all Cr-DLC coated samples with Cr/CrN interlayer of different thickness after repetitive impact test of 30000 times, a certain area of film spallation is observed at the central zone of impact craters, and the sample with Cr/CrN interlayer of 1.01μm has the least indentation volume of 9.241×10⁶μm³, which shows the best impact resistance. In summary, for Cr-DLC films with Cr/CrN interlayer prepared on copper alloy,when the thickness of Cr/CrN interlayer is 1.01μm and the whole thickness of the films is less than 8μm, the films show the best impact resistance.

The hemispherical resonator metallization coating is an important process in the manufacture of hemispherical resonator gyroscope. The residual stress of the film produced during the coating process has a great influence on the Q value of the resonator, which determines the final performance of the hemispherical resonator gyroscope, such as the stability of the bias.In this paper, X-ray diffraction method is used to measure the residual stress of the film, and the influence of the coating process parameters and the thickness of the film on the residual stress is studied.The results show that the film residual stress exhibits a state of compressive stress. As the sputtering power increases, the film stress increases first and then decreases, and there is a tendency to transform into tonsile stress. When the film thickness increases, the film stress first decreases slightly and then increases. The substrate temperature has no obvious regularity in the influence of the residual stress. The research in this paper may have important guiding significance for the establishment of the relationship model between the residual stress of the film and the Q value of the harmonic oscillator.

A new design scheme of arc stabilization power supply is introduced in this paper. It not only gives a detailed analysis of the theoretical basis, the unique main circuit topology construction, the control system composed of high-performance chips such as DSP and CPLD, but also some specific control software programs and circuit implementation methods are presented. Finally, a test prototype is developed according to the design idea, and relatively ideal result is obtained by testing the output waveform, which verifies the rationality and feasibility of the design scheme.

Spray freeze-drying technology has developed rapidly in recent years, which has been widely applied in food, medicine, materials and other fields. However, the corresponding spray freeze drying equipment has developed slowly, which limits the development of spray freeze drying technology to a certain extent. This paper first introduces the principle and characteristics of spray freeze drying technology. Then it introduces the current situation of spray freeze drying equipment,analyzes the advantages and disadvantages of the existing spray freeze drying equipment, summarizes the typical mathematical models of spray freeze drying process in recent years, and probes into the existing problems and future development directions of spray freeze drying technology.

Aimed at the problem of device short circuit caused by MEMS step etching, a method based on Bosch is proposed by analyzing the reason for silicon grass formation and the main process parameters of deep silicon step etching, such as etching passivation and Ar physical bombardment, which adopts periodic etching-passivation-pre-etching to form the precision step structure. The method greatly improves the bias power and time of reasonably allocating etching. The results show that, under the process conditions of pre-etching bias power of 100W and pre-etching time of 0.8s, the production of silicon grass can be effectively suppressed. After step etching is completed, SF₆ etching gas is used to clean the step silicon grass for 10s to ensure that the silicon grass is completely removed. At this time,the step drop structure obtained is flat and smooth, and the verticality of the etched comb teeth is better than 90°±1°. This method has the characteristics of good repeatability and simple process.