连续式IGBT真空焊接设备的设计与应用

doi:10.13385/j.cnki.vacuum.2026.02.11

摘要/Abstract

摘要： 本文针对DBC基板氧化、均匀化快速升降温、连续生产等问题,设计了连续式IGBT真空焊接设备,其长期使用温度400 ℃、工作真空度1 mbar、极限真空度0.1 mbar。详细介绍了设备连续式运行时的逻辑,IGBT芯片在载具上依次经过进口平台、预热腔、焊接腔、冷却腔和出口平台,采用甲酸作为还原剂,通过对真空焊接过程进行温度、压力等参数的控制完成IGBT芯片的真空焊接工艺过程,并对设备布局及动作逻辑、反应腔体、真空系统、气路系统、其它机械系统以及电气系统进行设计。设备装配调试完成后,根据IGBT芯片的真空焊接工艺进行了试验,其空洞率<1%,设备性能均达到车规级要求。

关键词: IGBT芯片, 真空焊接, 连续式设计, 空洞率

Abstract: In order to solve the problems of DBC substrate oxidation, rapid temperature rise and fall of homogenization, and continuous production, a continuous IGBT vacuum welding equipment was designed in this paper. The system has a long-term use temperature of 400 ℃, a working vacuum degree of 1 mbar, and an ultimate vacuum degree of 0.1 mbar. The logic of the continuous operation of the equipment was introduced in detail. The IGBT chip passed through the import platform, preheating chamber, welding cavity, cooling cavity and outlet platform on the carrier in turn. The formic acid was used as the reducing agent, and the vacuum welding process of the IGBT chip was completed by controlling the temperature, pressure and other parameters of the vacuum welding process. The design included the equipment layout, action logic, reaction chamber, vacuum system, gas circuit system, other mechanical systems, and electrical system. After the assembly and commissioning of the equipment was completed, the test was carried out according to the vacuum welding process of the IGBT chip. Its void rate is <1%, and the performance of the equipment meets the requirements of the vehicle specification level.

Key words: IGBT chip, vacuum welding, continuous design, void rate

中图分类号: TB79

李金伟, 陆玉, 蔡传辉. 连续式IGBT真空焊接设备的设计与应用[J]. 真空, 2026, 63(2): 75-83.

LI Jinwei, LU Yu, CAI Chuanhui. Design and Application of Continuous IGBT Vacuum Welding Equipment[J]. VACUUM, 2026, 63(2): 75-83.

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