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真空 ›› 2021, Vol. 58 ›› Issue (5): 11-15.doi: 10.13385/j.cnki.vacuum.2021.05.02

• 真空应用 • 上一篇    下一篇

柔性电子器件疲劳特性的研究进展*

李建鹏, 张驰, 李建昌   

  1. 东北大学机械工程与自动化学院真空流体工程研究中心,辽宁 沈阳110819
  • 收稿日期:2020-07-31 出版日期:2021-09-25 发布日期:2021-09-23
  • 通讯作者: 李建昌,教授,博士生导师。
  • 作者简介:李建鹏（1995-）,男,甘肃省敦煌市人,硕士生。
  • 基金资助:
    *国家自然科学基金（51773030）

Latest Studies on Fatigue Failure of Flexible Electronic Devices

LI Jian-peng, ZHANG Chi, LI Jian-chang   

  1. Vacuum and Fluid Engineering Research Center, School of Mechanical Engineering and Automation, Northeastern University, Shenyang 110819, China
  • Received:2020-07-31 Online:2021-09-25 Published:2021-09-23

摘要： 柔性电子器件因其柔韧性好、集成度高、可设计性强和在可穿戴方面的潜在应用,成为近年来微电子的研究热点之一。目前,研究重点进展到器件在疲劳过程中的具体失效情况及在不影响电学性能的同时提高柔性,本文从基底材料类型、器件电学性能影响因素和疲劳损伤等方面进行综述。首先,归纳了不同基底材料与器件类型;其次,对比了膜/基结构器件的电学性能与界面裂纹监测;重点讨论了拉伸、弯折对薄膜失效过程的影响及微裂纹萌生、扩展和饱和阶段的主要特点。结果表明：裂纹失效形式有张开型、滑开型与撕开型三类;加载速率使脆韧性断裂相互转换并分别对应发生穿晶与沿晶裂纹;基底刚度与裂纹颈缩呈正相关。进一步分析发现疲劳损伤大小与机械形变位错有关,结合模型验证了拉伸与弯折均符合此结论。未来应致力于提高材料的膜基匹配与耐拉弯性,完善原位观测并扩展直接观测器件疲劳失效机理的手段,对裂纹萌生进行可调控,提高理论模型精度并与疲劳实验更好结合,以期为开发超柔抗疲劳电子器件提供基础。

关键词: 柔性电子, 膜-基界面, 疲劳损伤行为, 断裂模型

Abstract: Recently, flexible electronics have attracted intensive interest owing to their potential applications in wearable devices with good flexibility, high integration, and high design ability. The research is developing on to the fatigue damage process and how to improve flexibility while keeping the excellent electrical performances now. In this article, the materials, electrical performance and fatigue failure of flexible electronics are systematically reviewed. First, the material properties and device characteristics are summarized. The charge transport and interfacial cracks of the devices are then compared and analyzed in detail. Particularly, the effects of tensile bending on the failure process of the film and the initiation, electrical properties, expansion and saturation of microcracks are mainly discussed. Three models of cracks can be mainly classified into open, sliding, and tear types. The loading rate has a critical point of brittle rupture and ductile fracture, which correspond to the crack of transgranular and intergranular, respectively. The structure stiffness positively correlating with crack necking is well understood. It is found that the fatigue damage is related to mechanical distortion, and the models verify that the tensile and bending can be well explained with this results. In the future, improving the matching between function layer and substrate, seeking new functional materials, expanding new monitoring method in fatigue failure, and developing noval integration technology of flexible devices will be the key directions in this filed. The studies on mathematical modeling and fatigue experiment need to be combined together, in order to prove guidance for the ultra-flexible and anti-fatigue electronic devices.

Key words: flexible electronics, active-layer/substrate interface, fatigue damage, fracture model

中图分类号: 

  • TB79
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