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VACUUM ›› 2025, Vol. 62 ›› Issue (2): 56-61.doi: 10.13385/j.cnki.vacuum.2025.02.09

• Thin Film • Previous Articles     Next Articles

Research on the Technology of RF Plasma Degluing and Surface Cleaning

TIAN Wenjuan1, HE Xiaobin2, JIAO Binbin2   

  1. 1. Beijing Dashihe Technology Co., Ltd., Beijing 102401, China;
    2. Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100020, China
  • Received:2023-11-21 Online:2025-03-25 Published:2025-03-24

Abstract: The chemical and physical changes of plasma degluing and cleaning are briefly introduced. The factors that determine the degluing effect and uniformity are analyzed systematically, and the corresponding scheme and the optimal parameter matching principle are given. The optimal removal process parameters of micro and nano scale Ar-F photoresist under different process conditions were studied through experiments, and several groups of process parameters with good degluing effect were obtained. The reaction principle and process of plasma cleaning, and the application of plasma cleaning in surface modification of materials are discussed.

Key words: plasma, dry removal of glue, glue removal rate, glue removal uniformity, surface modification

CLC Number:  TB79

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