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VACUUM ›› 2025, Vol. 62 ›› Issue (6): 16-24.doi: 10.13385/j.cnki.vacuum.2025.06.03

• Thin Film • Previous Articles     Next Articles

Effect of Different Gases and Storage Media on the Timeliness of Ion Beam Activation

ZHONG Li, JIN Fanya   

  1. Southwest Institute of Physics, Chengdu 610207, China
  • Received:2024-08-27 Online:2025-11-25 Published:2025-11-27

Abstract: To study the aging mechanism of high polymerization materials PEEK/GF after ion beam activation, they were activated with argon (Ar), hydrogen (H2), oxygen (O2), and a mixture of hydrogen and nitrogen (H2+N2), and stored in different media, including atmosphere, pure water, absolute ethanol, and vacuum, for 1-90 d. The changing pattern of the surface properties was analyzed by testing infrared spectroscopy and surface contact angle. On this basis, the copper film was deposited by magnetron sputtering coating technology, and the adhesion of the copper layer was determined qualitatively and quantitatively by scribing test and drawing test. A comprehensive study was then carried out in conjunction with the surface characteristics of the substrate. The results show that the PEEK/GF materials activated by different gases and stored in different media show a strong time-dependent behavior. When the storage medium is the same, H2+N2 activation has the best effect of improving the aging, and the rest are O2, H2 and Ar in order. When the activation gas is the same, storing the material in absolute ethanol has the best effect of improving the aging, and the rest are pure water, atmosphere and vacuum environment in order. Ion beam activation with H2+N2 or O2, and storage in hydrophilic medium can improve the activity of the substrate and delay timeliness effectively. The adhesion of copper films deposited on PEEK/GF immediately after ion beam activation is up to level 1/11.51 MPa, while the adhesion of copper films deposited on PEEK/GF after storage is significantly lower, and the maximum is only level 1/5.40 MPa.

Key words: ion beam activation, surface activity, timeliness, storage media, adhesion

CLC Number:  TQ311;TQ316;TQ317

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