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VACUUM ›› 2020, Vol. 57 ›› Issue (3): 5-6.doi: 10.13385/j.cnki.vacuum.2020.03.02

• Thin Film • Previous Articles     Next Articles

Simulation of MagnetronSputtering Enhancement Based on Plasma

WANG Xiao-ming1, E Dong-mei2, WU Jun-sheng1, ZHANG Xu-yue1, ZHOU Yan-wen1   

  1. 1. Research Institute of Surface Engineering, University of Science and Technology Liaoning, Anshan 114051, China;
    2. Shenyang Vacuum Technology Institute Co., Ltd., Shenyang 110042, China
  • Received:2019-02-26 Published:2020-06-18

Abstract: The vacuum deposition represented by magnetron sputtering has become the mainstream method for preparing thin films. Therefore, it is very important to choose a suitable model to study the distribution of plasma, particles and electrons during gas discharge in magnetron sputtering. According to the basic principle of gas discharge, the fluid model was adopted for cylindrical sputtering device, and the physical model of plasma with electrons, ions, metastable ions and neutral particles as the main particles is established. The finite difference method is applied to the model. The simulation results of plasma particle distribution and electron temperature distribution in DC sputtering system are obtained by computer programming to simulate the process of gas discharge in DC sputtering system.

Key words: plasma, magnetron sputtering, ion distribution

CLC Number: 

  • O411.3
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