真空 ›› 2024, Vol. 61 ›› Issue (4): 85-91.doi: 10.13385/j.cnki.vacuum.2024.04.16
刘诗梦1,2, 赵环宇3, 王杰1, 乔忠路1,2, 晋伟达1,2, 张仁柱1,2
LIU Shi-meng1,2, ZHAO Huan-yu3, WANG Jie1, QIAO Zhong-lu1,2, JIN Wei-da1,2, ZHANG Ren-zhu1,2
摘要: 先进陶瓷材料具有高硬度、高模量、耐高温、耐腐蚀等结构特性以及优异的热学、光学和电学等功能特性,因此在航天航空、信息技术、国防军工、生物医疗与新能源等领域得到越来越多的应用。高性能先进陶瓷材料需求的增加推动了制备工艺的发展,在陶瓷成型与烧结技术中引入真空技术可以通过改善陶瓷致密度、成分均匀性与晶粒尺寸分布等因素促进其性能的提升。本文着重对真空技术在不同成型与烧结方法中的应用进行了分析归纳,探讨了不同制备方法的特征及真空气氛对于陶瓷性能提升的作用机理,最后对未来的研究方向进行了展望。
中图分类号: TB32
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