不同气体和存储介质对离子束活化时效性的影响*

doi:10.13385/j.cnki.vacuum.2025.06.03

摘要/Abstract

摘要： 为了研究PEEK/GF聚合物材料在离子束活化后的时效性机理,用氩气（Ar）、氢气（H₂）、氧气（O₂）以及氢气与氮气的混合气体（H₂+N₂）对其进行离子束活化处理,并分别于大气、纯水、无水乙醇和真空等不同介质中存储1~90 d,通过材料表面红外光谱测试和表面接触角测试分析了材料表面特性的时效性变化规律,在此基础上以磁控溅射镀膜技术沉积铜膜,通过划格测试和拉拔测试对铜层的附着力进行了定性和定量判定,并结合基材的表面特性进行了综合分析。结果表明：经不同气体活化后存储于不同介质中的PEEK/GF材料均表现出较强的时效性;在存储介质相同时,以H₂+N₂、O₂、H₂、 Ar活化的时效性改善效果依次下降;在活化气体相同时,以无水乙醇、纯水、大气和真空环境为存储介质的时效性改善效果依次下降;采用H₂+N₂或O₂活化并存储于无水乙醇等亲水性较好的介质中可以减缓材料亲水性能的时效性;PEEK/GF材料经离子束活化后立刻沉积铜膜的附着力最高可达1级/11.51 MPa,经存储后再沉积铜膜的附着力明显降低,最高仅为1级/5.40 MPa。

关键词: 离子束活化, 表面活性, 时效性, 存储介质, 附着力

Abstract: To study the aging mechanism of high polymerization materials PEEK/GF after ion beam activation, they were activated with argon (Ar), hydrogen (H₂), oxygen (O₂), and a mixture of hydrogen and nitrogen (H₂+N₂), and stored in different media, including atmosphere, pure water, absolute ethanol, and vacuum, for 1-90 d. The changing pattern of the surface properties was analyzed by testing infrared spectroscopy and surface contact angle. On this basis, the copper film was deposited by magnetron sputtering coating technology, and the adhesion of the copper layer was determined qualitatively and quantitatively by scribing test and drawing test. A comprehensive study was then carried out in conjunction with the surface characteristics of the substrate. The results show that the PEEK/GF materials activated by different gases and stored in different media show a strong time-dependent behavior. When the storage medium is the same, H₂+N₂ activation has the best effect of improving the aging, and the rest are O₂, H₂ and Ar in order. When the activation gas is the same, storing the material in absolute ethanol has the best effect of improving the aging, and the rest are pure water, atmosphere and vacuum environment in order. Ion beam activation with H₂+N₂ or O₂, and storage in hydrophilic medium can improve the activity of the substrate and delay timeliness effectively. The adhesion of copper films deposited on PEEK/GF immediately after ion beam activation is up to level 1/11.51 MPa, while the adhesion of copper films deposited on PEEK/GF after storage is significantly lower, and the maximum is only level 1/5.40 MPa.

Key words: ion beam activation, surface activity, timeliness, storage media, adhesion

中图分类号: TQ311;TQ316;TQ317

钟利, 金凡亚. 不同气体和存储介质对离子束活化时效性的影响^*[J]. 真空, 2025, 62(6): 16-24.

ZHONG Li, JIN Fanya. Effect of Different Gases and Storage Media on the Timeliness of Ion Beam Activation[J]. VACUUM, 2025, 62(6): 16-24.

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