基于系统回归模型的真空镀膜设备液冷加热盘设计方法研究*

doi:10.13385/j.cnki.vacuum.2024.04.02

真空 ›› 2024, Vol. 61 ›› Issue (4): 6-11.doi: 10.13385/j.cnki.vacuum.2024.04.02

基于系统回归模型的真空镀膜设备液冷加热盘设计方法研究^*

李翔¹, 姜小蛟¹, 战春鸣², 刘昂¹, 孙宁¹, 李加平¹

1.沈阳富创精密设备股份有限公司,辽宁沈阳 110015;
2.沈阳真空技术研究所有限公司,辽宁沈阳 110042

收稿日期:2024-04-11 出版日期:2024-07-25 发布日期:2024-07-29
作者简介:李翔（1991-）,男,辽宁省沈阳市人,硕士,工程师。
基金资助:
* 辽宁科技重点项目（2023JH1/11200010）

Research on Design Method of Liquid Cooled Heater for Vacuum Coating Equipment Based on System Regression Model

LI Xiang¹, JIANG Xiao-jiao¹, ZHAN Chun-ming², LIU Ang¹, SUN Ning¹, LI Jia-ping¹

1. Shenyang Fortune Precision Equipment Co., Ltd., Shenyang 110015, China;
2. Shenyang Vacuum Technology Institute Co., Ltd., Shenyang 110042, China

Received:2024-04-11 Online:2024-07-25 Published:2024-07-29

摘要/Abstract

摘要： 晶圆加热盘的设计有两大核心性能指标：工作面温度均匀性和控温能力,晶圆加热盘在设计定型前需要经过多次仿真迭代与测试验证,以确定产品性能满足设计需求。本研究基于有限元计算与系统回归模型,精准预测加热器实际所需长度、功率密度以及对应排布方案,以温度均匀性为优化目标,获取最优设计方案。经不同方案验证,该模型的精度在98%以上,可显著提升加热盘设计效率,为人工智能在加热盘设计领域的应用提供可能性。此外,基于传热学理论,提出了一种加热盘控温能力的设计方法,通过一维计算的方式,为加热盘控温能力的优化设计起到了指导作用。

关键词: 半导体, 真空镀膜设备, 晶圆加热盘, 水冷, 回归模型, 控温能力

Abstract: The design of wafer heating plate has two core performance indicators: uniformity of working surface temperature and temperature control ability, and the wafer heating plates needs to be verified by multiple simulation iterations and tests before the design is finalized to determine that the product performance meets the design requirements. Based on the finite element calculation and system regression model, this study accurately predicts the actual required length, power density and corresponding layout scheme of the heater, and proposes a method to obtain the optimal solution with temperature uniformity as the goal. The verification results of different schemes show that the accuracy of the model is above 98%, which can greatly improve the design efficiency of heating plate and provide the possibilities for the application of artificial intelligence in the field of heating plate design. In addition, based on the theory of heat transfer, a design method for heating plate temperature control ability is proposed, which guides the design of heating plate temperature control ability through one-dimensional calculation.

Key words: semiconductor, vacuum coating equipment, wafer heater, water cooling, regression model, thermal control

中图分类号: TB43

李翔, 姜小蛟, 战春鸣, 刘昂, 孙宁, 李加平. 基于系统回归模型的真空镀膜设备液冷加热盘设计方法研究^*[J]. 真空, 2024, 61(4): 6-11.

LI Xiang, JIANG Xiao-jiao, ZHAN Chun-ming, LIU Ang, SUN Ning, LI Jia-ping. Research on Design Method of Liquid Cooled Heater for Vacuum Coating Equipment Based on System Regression Model[J]. VACUUM, 2024, 61(4): 6-11.

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基于系统回归模型的真空镀膜设备液冷加热盘设计方法研究^*

Research on Design Method of Liquid Cooled Heater for Vacuum Coating Equipment Based on System Regression Model

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