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VACUUM ›› 2020, Vol. 57 ›› Issue (6): 5-6.doi: 10.13385/j.cnki.vacuum.2020.06.02

• Thin Film • Previous Articles     Next Articles

Effect of Hall Source Sputtering Cleaning Process on Bonding Properties of Ion Plating TiN Coatings

ZHONG Li, DAN Min, SHEN Li-ru, JIN Fan-ya, CHEN Mei-yan, LIU Tong, DENG Zhi   

  1. Southwestern Institute of Physics, Chengdu 610207, China
  • Received:2019-09-06 Online:2020-11-25 Published:2020-11-30

Abstract: Aiming for studying the mechanism and regularity of the effect of sputtering cleaning process on the surface characteristics of substrates, the Hall ion source was used to generate argon ion beam to clean substrates. The surface characteristics of substrates after ion beam cleaning under different discharge voltage and the bonding strength of coatings were then compared after changing discharge voltage of ion beam by adjusting the vacuum degree. The results show that with the increase of vacuum, the discharge voltage of ion beam increased gradually, the contact angle of substrate decreased gradually, and the surface roughness of substrate decreased first and then increased. The bonding strength of the coatings increased gradually with the increase of ion beam discharge voltage, up to 60N. It can be a concluded that the substrate surface could obtain good wettability, ductility and cleanliness after high energy argon ion beam sputtering cleaning, which can effectively improve the bonding performance of the coating.

Key words: Hall source, sputtering cleaning, ion beam discharge voltage, ion plating, TiN

CLC Number: 

  • TB79
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