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VACUUM ›› 2021, Vol. 58 ›› Issue (4): 1-5.doi: 10.13385/j.cnki.vacuum.2021.04.01

• Thin Film •     Next Articles

Study on Uniformity of Inclined Magnetron Sputtering with Small Circular Plane Target

FU Xue-cheng, XU Jin-bin, WU Li-ying, HUANG Sheng-li, WANG Ying   

  1. Advanced Electronics Materials and Devices,Shanghai Jiao Tong University,Shanghai 200240,China
  • Received:2020-06-02 Online:2021-07-25 Published:2021-08-05

Abstract: Based on the actual situation of the inclined magnetron sputtering with the circular plane target, the mathematical model is established according to the characteristics of the angle between the annular etching groove of the target and the horizontal workpiece table. Matlab software is used to simulate and study the influence of different angle on the film thickness distribution when the target and workpiece table are facing each other and the height is fixed. We found that the film thickness increases first and then decreases in the horizontal distance between the worktable and the target. When the target angle is appropriate, the film deposition rate changesapproximately in a straight line within the fixed area of the worktable. We simulated the uniformity on the 4-inch substrate according to the actual characteristics of thedecreasing distribution of the film thickness in the horizontal plane of the worktable. According to the results of theoretical simulation,tantalum nitride films with nonuniformity less than 0.6% were prepared on a 4-inch substrate, which verified the correctness of the mathematical model. The reason why the experimental results are better thanthat of the simulation is explained. This work provides a reference for the design and manufacture of magnetron sputtering coating equipment.

Key words: circular plane target, magnetron sputtering, inclined sputtering, mathematical model, high uniformity

CLC Number: 

  • TB43
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