Abstract: Aiming at the traditional aluminum production technology, in order to improve the adhesion and barrier property of the film, the RF magnetron sputtering aluminum plating process was adopted to prepare the high barrier layer of pure aluminum by depositing pure aluminum on the surface of PET plastic film. The influences of RF power and sputtering air pressure on film adhesion and barrier property were investigated by changing the parameters of RF power and sputtering air pressure. The results show that the RF power and sputtering pressure in the deposition process have a great influence on the performance of the magnetron sputtered Al film. Under a certain sputtering pressure, the bonding strength of the film layer gradually increases with the increase of the RF power, and the barrier property of the film layer increases with the increase of the RF power, and then decreases. When the RF power is 85W, the minimum oxygen transmittance is 1.11cm³/（m²·day·atm）. Under the condition of the same RF power, the binding force increases first and then decreases with the increase of sputtering air pressure, and the barrier property of the film decreases gradually with the increase of sputtering air pressure. When the sputtering pressure was 0.5Pa, the highest binding force was 1.68N/mm. Compared with the traditional aluminum film, the binding force is increased by 2 times and the barrier property is increased by 5 times.

Key words: Al, high barrier materials, RF magnetron sputtering, RF power, sputtering pressure