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VACUUM ›› 2026, Vol. 63 ›› Issue (4): 8-13.doi: 10.13385/j.cnki.vacuum.2026.04.02

• Thin Film • Previous Articles     Next Articles

Comparative Study on the Performance of Aluminum Films Deposited by Electron Beam Evaporation and Magnetron Sputtering

FU Xuecheng1, CHEN Liang2, CHENG Xiulan1, DU Hongji2, SHI Kaixuan1   

  1. 1. Advanced Electronics Materials and Devices, Shanghai Jiao Tong University, Shanghai 200240, China;
    2. Beijing Vikaitech Co., Ltd., Beijing 101300 China
  • Received:2025-09-29 Published:2026-07-27

Abstract: Using a dual-chamber electron beam evaporation system and an improved bottomless alumina crucible, combined with a step-by-step evaporation process, the density and uniformity of aluminum films deposited by electron beam evaporation are significantly enhanced. Compared with the magnetron sputtering coating equipment, 1-micron-thick aluminum films were deposited on 4-inch silicon substrates. The resistivity, uniformity, reflectivity, and density of the films were tested. The results show that the aluminum films prepared by the improved electron beam evaporation technique outperform those deposited by magnetron sputtering in terms of resistivity, uniformity, and reflectivity, while there is no difference in density between the two methods. This research provides new evidence for revising the performance comparison between the two methods in preparing aluminum films.

Key words: dual-chamber electron beam evaporation system, electron beam evaporation, magnetron sputtering, aluminum film, performance comparison

CLC Number:  TB43

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