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VACUUM ›› 2021, Vol. 58 ›› Issue (6): 43-47.doi: 10.13385/j.cnki.vacuum.2021.06.08

• Thin Film • Previous Articles     Next Articles

Effect of Metallic Multilayer Films on Gold Wire Bonding Properties

YANG Zhao1,2,3, LUO Jun-yao1,2, LI Bao-chang1,2, LI Shu-hua1,2, TA Shi-wo1,2, FU Zhen-xiao1,2, NING Hong-long3   

  1. 1. Guangdong Fenghua Advanced Technology Holding Co., Ltd., Zhaoqing 526020, China;
    2. State Key Laboratory of Advanced Material and Electronic Components, Zhaoqing 526020, China;
    3. School of Materials Science and Engineering, South China University of Technology, Guangzhou 510641, China
  • Received:2020-10-20 Online:2021-11-25 Published:2021-11-30

Abstract: Multilayer films with different structures(TiW/Ni/Au & Ti/Ni/Au) and thicknesses were deposited on ceramic substrates (96Al2O3) by magnetron sputtering. The gold film thickness was controlled by adjusting the sputtering time. The multilayer films were used to simulate the gold wire bonding in optical communication modules, and their bonding performance were evaluated. The results show that Ti/Ni/Au structure has better bonded effect than that of the TiW/Ni/Au. In the experiment of gold wire bonding with different thickness, the magnitude of pull and thrust strength changes with the increase of gold layer thickness. The pull strength is kept in 7.5gf±3% when the thickness is less than 2μm(1gf=9.81× 10-3N）. When the thickness of the gold film is 930 nm, the thrust strength is the maximum(78.68gf), and it decreases with the increase of the thickness. Then, the thrust strength is kept in 72.03gf±1.8%. The results of statistical analysis show that the dispersion degree of push and thrust strength decreases first and then increases with the increase of thickness. Therefore, there is a certain relationship between the bonding properties and the structure and thickness of the bonding film layer. The results show that the thickness is too thin to bond with the gold wire, while the thicker film reduces the matching with the bonding process. This indicates that the bonding quality can be controlled and the cost can be saved by reducing the thickness of the gold layer.

Key words: multilayer films, gold wire bonding, magnetron sputtering, optical-communication

CLC Number: 

  • O484.1
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