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真空 ›› 2025, Vol. 62 ›› Issue (5): 53-57.doi: 10.13385/j.cnki.vacuum.2025.05.08

• 薄膜 • 上一篇    下一篇

磁控溅射In2Se3薄膜缓冲层性能研究*

赵颖1,2, 刘沅东3, 林冰2, 张海龙2   

  1. 1.四川能投氢能产业投资有限公司,四川 成都 610000;
    2.西南石油大学,四川 成都 610500;
    3.北京市科学技术研究院,北京 100089
  • 收稿日期:2024-12-12 发布日期:2025-09-29
  • 通讯作者: 刘沅东,博士,高级工程师。
  • 作者简介:赵颖(1986-),女,辽宁瓦房店人,硕士,高级工程师。
  • 基金资助:
    *四川省自然科学基金青年基金项目(23NSFSC3023)资助

Study on the Properties of Sputtered In2Se3 Buffer Layers

ZHAO Ying1,2, LIU Yuandong3, LIN Bing2, ZHANG Hailong2   

  1. 1. Sichuan Energy Investment Hydrogen Industry Investment Co., Ltd., Chengdu 610000, China;
    2. Southwest Petroleum University, Chengdu 610500, China;
    3. Beijing Academy of Science and Technology, Beijing 100089, China
  • Received:2024-12-12 Published:2025-09-29

摘要: 为了探索一种低毒性的缓冲层材料来替代Cu(In, Ga)Se2(CIGS)薄膜电池中常用的CdS缓冲层,采用磁控溅射技术,以In2Se3为靶材制备薄膜材料,系统研究了单纯溅射﹑掺氧溅射以及后退火处理对薄膜的化学计量比﹑带隙和透过率的影响。结果表明,单纯溅射制备的In2Se3薄膜透过率很低;而掺杂氧气进行溅射,虽然可以改善薄膜的透过率,但是会对薄膜化学计量比产生较大影响;后退火处理对薄膜性能的影响微乎其微。采用磁控溅射技术制备的In2Se3薄膜,其性能尚难以满足缓冲层材料的应用需求。

关键词: 缓冲层, In2Se3, 磁控溅射, 带隙, 透过率

Abstract: In order to explore a low-toxicity buffer layer material to replace the CdS buffer layer commonly used in Cu(In,Ga)Se2 (CIGS) solar cells, magnetron sputtering technology was used to prepare thin film materials based on In2Se3 targets. The effects of pure sputtering, oxygen-doped sputtering and post-annealing treatment on the stoichiometric ratio, band gap and transmittance characteristics of the films were systematically studied. The results show that the transmittance of In2Se3 films prepared by sputtering is very low. Although the transmittance of the films can be improved by sputtering doped with oxygen, the stoichiometric ratio of the films will be greatly affected. The effect of post-annealing treatment on the properties of the films is negligible. The performance of In2Se3 thin films prepared by magnetron sputtering technology is still difficult to meet the application requirements of buffer layer materials.

Key words: buffer layer, In2Se3, magnetron sputtering, band gap, transmittance

中图分类号:  TB34

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